![US20160133486A1 - Double Layer Release Temporary Bond and Debond Processes and Systems - Google Patents US20160133486A1 - Double Layer Release Temporary Bond and Debond Processes and Systems - Google Patents](https://patentimages.storage.googleapis.com/10/af/89/a69c22aeb8d741/US20160133486A1-20160512-D00000.png)
US20160133486A1 - Double Layer Release Temporary Bond and Debond Processes and Systems - Google Patents
![LASER debonding and cleaning equipment | Shin-Etsu Engineering | Processing, Trading & Specialized Services | Business & Products | Shin-Etsu Chemical Co., Ltd. LASER debonding and cleaning equipment | Shin-Etsu Engineering | Processing, Trading & Specialized Services | Business & Products | Shin-Etsu Chemical Co., Ltd.](https://www.shinetsu.co.jp/wp-content/uploads/2020/02/%E3%83%AC%E3%83%BC%E3%82%B6%E3%83%87%E3%83%9C%E3%83%B3%E3%83%89%E6%B4%97%E6%B5%84%E8%A3%85%E7%BD%AE.jpg)
LASER debonding and cleaning equipment | Shin-Etsu Engineering | Processing, Trading & Specialized Services | Business & Products | Shin-Etsu Chemical Co., Ltd.
![The Growing Application Field of Laser Debonding: From Advanced Packaging to Future Nanoelectronics | Semantic Scholar The Growing Application Field of Laser Debonding: From Advanced Packaging to Future Nanoelectronics | Semantic Scholar](https://d3i71xaburhd42.cloudfront.net/f82edb45127bb94f635a6f8ace99190fdfdd5578/3-Figure3-1.png)
The Growing Application Field of Laser Debonding: From Advanced Packaging to Future Nanoelectronics | Semantic Scholar
![IFTLE 200 Semicon West Suss Workshop: Laser Debonding and KLA Tencor platform for WLP inspection | Insights From Leading Edge IFTLE 200 Semicon West Suss Workshop: Laser Debonding and KLA Tencor platform for WLP inspection | Insights From Leading Edge](http://electroiq.com/insights-from-leading-edge/wp-content/uploads/sites/4/2014/07/Suss-temp-1.jpg)
IFTLE 200 Semicon West Suss Workshop: Laser Debonding and KLA Tencor platform for WLP inspection | Insights From Leading Edge
![Wafer-to-wafer selective flip-chip transfer by sticky silicone bonding and laser debonding for rapid and easy integration test | Semantic Scholar Wafer-to-wafer selective flip-chip transfer by sticky silicone bonding and laser debonding for rapid and easy integration test | Semantic Scholar](https://d3i71xaburhd42.cloudfront.net/e4005206aeb3df5a85e3538e62741f318e2783b5/1-Figure1-1.png)
Wafer-to-wafer selective flip-chip transfer by sticky silicone bonding and laser debonding for rapid and easy integration test | Semantic Scholar
![LASER debonding equipment | Shin-Etsu Engineering | Processing, Trading & Specialized Services | Business & Products | Shin-Etsu Chemical Co., Ltd. LASER debonding equipment | Shin-Etsu Engineering | Processing, Trading & Specialized Services | Business & Products | Shin-Etsu Chemical Co., Ltd.](https://www.shinetsu.co.jp/wp-content/uploads/2020/02/%E3%83%AC%E3%83%BC%E3%82%B6%E3%83%87%E3%83%9C%E3%83%B3%E3%83%89%E8%A3%85%E7%BD%AE.jpg)
LASER debonding equipment | Shin-Etsu Engineering | Processing, Trading & Specialized Services | Business & Products | Shin-Etsu Chemical Co., Ltd.
![a) Principle of the Laser Adhesion Test, (b) debonding of a painting... | Download Scientific Diagram a) Principle of the Laser Adhesion Test, (b) debonding of a painting... | Download Scientific Diagram](https://www.researchgate.net/profile/Michel-Arrigoni/publication/228927172/figure/fig1/AS:651575332700160@1532359073326/a-Principle-of-the-Laser-Adhesion-Test-b-debonding-of-a-painting-45m-thick-on.png)